A monolithic visible, infrared and terahertz 2D detector

Author

Perenzoni, Matteo ; Massari, Nicola ; Pocas, Stéphane ; Meilhan, Jérôme ; Simoens, François

Author_Institution

Fondazione Bruno Kessler, Trento, Italy

fYear

2010

fDate

5-10 Sept. 2010

Firstpage

1

Lastpage

2

Abstract

A monolithic multispectral detector for imaging in the visible (VIS), infrared (IR) and terahertz (THz) ranges has been designed for operation at room temperature. This sensor is composed of a CMOS readout integrated circuit (ROIC) housing visible photodiodes and of IR and THz microbolometer pixels processed above the CMOS wafer. Without package- and system-level issues, targeted individual pixel sensitivities are respectively an 80dB dynamic range for VIS photodiodes, a NETD=50mK @f/1 for IR and a THz NEP smaller than 10pW. Prototyping chips will be integrated in tri-spectral imaging and THz spectroscopy demonstration systems.

Keywords

CMOS integrated circuits; bolometers; infrared detectors; infrared imaging; monolithic integrated circuits; photodiodes; terahertz wave detectors; terahertz wave imaging; terahertz wave spectra; CMOS readout integrated circuit; CMOS wafer; IR microbolometer; THz microbolometer; THz spectroscopy demonstration system; VIS photodiodes; infrared imaging; monolithic multispectral detector; photodiodes; terahertz 2D detector; terahertz imaging; trispectral imaging; visible imaging; Bolometers; CMOS integrated circuits; Detectors; Imaging; Photodiodes; Pixel; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Infrared Millimeter and Terahertz Waves (IRMMW-THz), 2010 35th International Conference on

Conference_Location

Rome

Print_ISBN

978-1-4244-6655-9

Type

conf

DOI

10.1109/ICIMW.2010.5612874

Filename

5612874