Implementing heterogeneous microsystems in a three-dimensional packaging technology

This paper demonstrates how a low cost three-dimensional packaging technology can be utilised to implement heterogeneous microsystems. Systems which integrate sensors, actuators and signal processing are highly complex and often require custom packaging to maximise their potential. Using a novel multichip module packaging technology, referred to as MCM-V (multichip module-vertical) we have demonstrated that three-dimensional MCMs can be applied in the production of high-density microsystems incorporating sensors, bare die and discrete components. As an example, we describe two microsystems, one of which integrates an image sensor and programmable processing resources