Title :
Finite element modeling of printed circuit board for structural analysis
Author_Institution :
Prod. Eng. Res. Center, LG Electron. Inc., Pyungtaik, South Korea
Abstract :
Printed circuit boards with unfavourable deflection have been considered for better mechanical design. During the reflow process, the PCB has experienced a temperature range between ambient temperature and peak furnace temperature. Out of plane deflection is generated due to the thermal properties mismatch of the material composition. The combination of board materials and copper plating is researched for investigation of the cause of the trouble and for design improvements. The effects of soldering and mounted component weight are ignored due to the input data complexity. A set of real PCBs has been exposed in a reflow process and deflection data is collected for comparison. As part of the analysis procedure, a finite element model for board deflection was proposed
Keywords :
finite element analysis; printed circuit design; printed circuit manufacture; printed circuit testing; reflow soldering; thermal analysis; thermal expansion; thermal stresses; Cu; PCB deflection; PCB out-of-plane deflection; PCB temperature range; ambient temperature; board deflection; board materials; copper plating; deflection data; finite element model; finite element modeling; input data complexity; material composition; mechanical design; mounted component weight; peak furnace temperature; printed circuit board; reflow process; soldering; structural analysis; thermal properties mismatch; CD-ROMs; Composite materials; Copper; Finite element methods; Furnaces; Integrated circuit modeling; Printed circuits; Production; Temperature distribution; Thermal stresses;
Conference_Titel :
Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
Conference_Location :
Norrkoping
Print_ISBN :
0-7803-3865-0
DOI :
10.1109/PEP.1997.656471
