• DocumentCode
    2723331
  • Title

    CMP3F: a high speed fault simulator for the Connection Machine

  • Author

    Agrawal, Ajit ; Bhattacharya, Debashis

  • Author_Institution
    Dept. of Comput. Sci., Brown Univ., Providence, RI, USA
  • fYear
    1990
  • fDate
    10-14 Sep 1990
  • Firstpage
    410
  • Lastpage
    416
  • Abstract
    The authors present a high-speed fault simulator, called CMP3F, that performs parallel-pattern, parallel-fault simulation, implemented on the Connection Machine (CM). Unlike conventional parallel pattern or parallel fault simulators, CMP3F can dynamically choose the fault set size as well as the number of vectors being simulated in parallel. Hence, the fault simulation process is split into several phases. The first phase primarily uses fault-list partitioning because, initially, the fault-list size dominates the fault simulation time. If fault dropping is allowed, CMP3F goes through a number of subsequent phases as the fault list becomes smaller, simulating an increasing number of distinct sets of vectors in parallel. Thus, CMP3F avoids useless computations when a small number of faults are present and maintains nearly linear speedup with an increasing number of processors. Experimental data obtained using ISCAS85 benchmark circuits suggest that CMP3F implemented on a fully configured 64 K-node CM, will perform fault simulation one to two orders of magnitude faster than most existing fault simulators
  • Keywords
    automatic testing; circuit analysis computing; digital integrated circuits; digital simulation; fault location; logic testing; parallel algorithms; parallel architectures; parallel machines; performance evaluation; 64 KB; CMP3F; Connection Machine; ISCAS85 benchmark circuits; dynamic simulation; fault dropping; fault-list partitioning; high speed fault simulator; nearly linear speedup; parallel pattern simulation; parallel-fault simulation; Algorithm design and analysis; Circuit faults; Circuit simulation; Displays; Extrapolation; Graphics; Prototypes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1990. Proceedings., International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-8186-9064-X
  • Type

    conf

  • DOI
    10.1109/TEST.1990.114049
  • Filename
    114049