Quantitative estimate of the characteristics of conductive particles in ACA by using nano indenter

Author

Wang, Xitao ; Wang, Yanli ; Chen, Guoliang ; Liu, Johan ; Lai, Zonghe

Author_Institution

State Key for Adv. Metals & Mater., Univ. of Sci. & Technol., Beijing, China

fYear

1997

fDate

26-30 Oct 1997

Firstpage

101

Lastpage

106

Abstract

The characteristics of conductive particles in anisotropically conductive adhesives (ACA) were studied by optical microscopy observation and nano indenter measurements. The indentation measurement was performed at the particles in ACA joints using different bonding forces. The load-displacement curves and microhardness values are obtained, which indicate that the nano indenter could be used for quantitative estimation of the electrical and mechanical characteristics of conductive particles in ACAs

Keywords

adhesion; conducting polymers; filled polymers; flip-chip devices; microhardness; nanotechnology; optical microscopy; packaging; ACA; ACA joints; anisotropically conductive adhesives; bonding forces; conductive particles; electrical characteristics; flip chip bonding; indentation measurement; load-displacement curves; mechanical characteristics; microhardness; nano indenter; nano indenter measurements; optical microscopy; quantitative estimation; Anisotropic magnetoresistance; Bonding forces; Conducting materials; Conductive adhesives; Conductivity measurement; Glass; Mechanical factors; Mechanical variables measurement; Optical microscopy; Particle measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on

Conference_Location

Norrkoping

Print_ISBN

0-7803-3865-0

Type

conf

DOI

10.1109/PEP.1997.656480

Filename

656480