Title :
ASIC-based batteryless implantable telemetry microsystem for recording purposes
Author :
Parramon, J. ; Doguet, P. ; Marin, D. ; Verleyssen, M. ; Muñoz, R. ; Leija, L. ; Valderrama, E.
Author_Institution :
CNM, Barcelona, Spain
Abstract :
This paper presents an implantable batteryless telemetric microsystem for EMG recording, based on a single 30 mm2 high-voltage 2.5 μm BiCMOS ASIC, which includes telemetric and two-channels recording circuits. It has been developed within the framework of an European project, where this device is implanted in rabbits for research studies related to control of prosthesis through muscular biosignals. Power is transferred with a 10 MHz inductive link using an efficient Class-E driver. Data is transmitted bi-directionally reaching elevate bit-rates. Microimplant volume is about 1 cm3 (including power and transmitter coil) with an overall current consumption of 4,5 mA. Despite problems detected with the EMG recording circuitry a functional transcutaneous batteryless implantable telemetric system has been achieved successfully. Power and digital data communication results are presented through in-vitro and in-vivo experiments (in rabbits)
Keywords :
BiCMOS integrated circuits; application specific integrated circuits; biocontrol; biomedical electrodes; biomedical electronics; biomedical telemetry; electromyography; microelectrodes; neuromuscular stimulation; prosthetics; 2.5 micron; 30 mm; EMG recording; HV BiCMOS ASIC; digital data communication; efficient Class-E driver; functional transcutaneous system; implantable batteryless telemetric microsystem; in-vitro experiments; in-vivo experiments; inductive link; muscular biosignals; neuromuscular stimulation; prosthesis control; rabbits; Application specific integrated circuits; BiCMOS integrated circuits; Bidirectional control; Coils; Driver circuits; Electromyography; Prosthetics; Rabbits; Telemetry; Transmitters;
Conference_Titel :
Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-4262-3
DOI :
10.1109/IEMBS.1997.758801