DocumentCode :
2724798
Title :
Terabit/sec 48-channel fiber-coupled optical module based on holey CMOS transceiver IC
Author :
Doany, Fuad E. ; Lee, Benjamin G. ; Rylyakov, Alexander V. ; Kuchta, Daniel M. ; Jahnes, Christopher ; Baks, Christian ; Libsch, Frank ; Schow, Clint L.
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2012
fDate :
May 29 2012-June 1 2012
Firstpage :
1499
Lastpage :
1504
Abstract :
A compact optical transceiver module providing 0.48 Tb/s transmitter plus 0.48 Tb/s receiver throughput has been demonstrated using a second-generation single-chip holey CMOS transceiver IC. The single-chip CMOS transceiver IC designed in standard 90nm IBM CMOS has 24 receiver and 24 laser driver circuits each with a corresponding through-substrate optical via (hole). The forty-eight 150-um diameter optical vias are fabricated using a wafer-scale deep Si RIE process followed by substrate thinning to 150um thickness. Direct flip-chip attachment of custom-designed 24-channel 850-nm VCSEL and PD arrays to the IC using AuSn solder provides a compact 48-channel Optochip measuring only 5.2mm × 5.8mm. The 48 optical vias enable optical access to the 24 VCSELs and 24 PDs and are arranged in a 4 × 12 array on 250um × 250um pitch to facilitate direct fiber-coupling to a standard 4 × 12 fiber array. The Optochips are packaged into complete modules by flip-chip soldering to high-density, high-speed organic carriers using eutectic PbSn solder. The organic carrier measures 17mm × 17mm with C4 pads on the top surface for Optochip attachment and typical ball grid array (BGA) pads on 0.8mm pitch on the bottom surface to permit attachment to a larger printed circuit board, i.e. system motherboard. Due to the exclusive use of flip-chip soldering throughout the assembly process, the holey Optochips and transceiver modules offer the potential of unprecedented highspeed performance and I/O density. Optical modules have been fabricated and DC optical measurement verified good bond yield for the OE arrays to IC and the IC to organic carrier. High-speed characterization of the complete module attached to a test motherboard demonstrated 24 transmitter channels operating up to 20 Gb/s/ch. Receiver characterization was carried out as full transmitter-to-receiver link - the output of a reference transmitter channel was coupled into a MMF and directed to - 4 receiver channels within a module. The transmitter-to-receiver measurements also operated up to 20 Gb/s/ch. At 20 Gb/s/ch, the 48-channel module delivers an unprecedented off-card I/O bandwidth of 0.96 Tb/s.
Keywords :
CMOS integrated circuits; ball grid arrays; driver circuits; elemental semiconductors; flip-chip devices; gold alloys; lead alloys; optical fibre couplers; optical transceivers; printed circuits; silicon; solders; sputter etching; surface emitting lasers; tin alloys; 48-channel fiber-coupled optical module; AuSn; AuSn solder; DC optical measurement; IBM CMOS; PD arrays; PbSn; Si; VCSEL; ball grid array; bit rate 0.48 Tbit/s; compact optical transceiver module; direct flip-chip attachment; eutectic PbSn solder; flip-chip soldering; laser driver circuits; optical receiver; optical transmitter; optochip; organic carrier; printed circuit board; second-generation holey CMOS transceiver IC; single-chip holey CMOS transceiver IC; size 150 nm; size 90 nm; substrate thinning; through-substrate optical via; wafer-scale deep Si RIE process; wavelength 850 nm; Connectors; High speed optical techniques; Integrated circuits; Integrated optics; Optical device fabrication; Optical receivers; Optical transmitters;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2012.6249034
Filename :
6249034
Link To Document :
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