Title :
3D stacked microfluidic cooling for high-performance 3D ICs
Author :
Yue Zhang ; Dembla, Ashish ; Joshi, Yash ; Bakir, Muhannad S.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
May 29 2012-June 1 2012
Abstract :
Cooling is a significant challenge for high-performance high-power 3D ICs. hi this paper, we describe the experimental evaluation of 3D ICs with embedded microfluidic cooling. Different architectures are experimentally evaluated ine hiding: 1) a memory-on-processor stack. 2) a processor-on-processor stack with equal power dissipation, and 3) a processor-on-processor stack with different power dissipation, hi all cases, embedded microfluidic cooling shows significant junction temperature reduction compared to air-cooling.
Keywords :
cooling; embedded systems; integrated circuit design; integrated circuit packaging; three-dimensional integrated circuits; 3D integrated circuits; 3D stacked microfluidic cooling; air cooling; embedded microfluidic cooling; junction temperature reduction; memory-on-processor stack; power dissipation; processor-on-processor stack; Heat sinks; Heating; Microfluidics; Power dissipation; Temperature measurement; Through-silicon vias; 3D IC centric heat suik design; High performance 3D IC; on-demand interlayer cooling; single phase cooling;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2012.6249058
