Title :
The beneficial effect of underfilling on the reliability of flip-chip joints
Author_Institution :
Thomson Multimedia, VS-Villingen, Germany
Abstract :
Recently, several low cost alternatives for flip-chip interconnection technology have been investigated. The scope of this paper is a reliability study of flip-chip assemblies on various substrates (mainly FR4). The deterioration (characterised by the electrical resistance) of isotropically conductive adhesive and of solder (63Sn37Pb, 96.5Sn3.5Ag) bumps caused by both thermal cycling and thermal shocks are described. These investigations confirm that in low cost flip-chip technology, there is practically no reliable bump interconnection without using underfill material
Keywords :
adhesion; assembling; conducting polymers; electric resistance; filled polymers; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; soldering; thermal shock; FR4 substrates; SnAg; SnAg solder bumps; SnPb; SnPb solder bumps; cost; flip-chip assemblies; flip-chip interconnection technology; flip-chip joints; flip-chip technology; isotropically conductive adhesive; reliability; reliable bump interconnection; thermal cycling; thermal shock; underfill material; underfilling; Conductive adhesives; Costs; Electric resistance; Electric shock; Electrical resistance measurement; Integrated circuit interconnections; Integrated circuit technology; Testing; Thermal conductivity; Thermal resistance;
Conference_Titel :
Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
Conference_Location :
Norrkoping
Print_ISBN :
0-7803-3865-0
DOI :
10.1109/PEP.1997.656506
