• DocumentCode
    2728046
  • Title

    Generalized hybrid modeling to estimate chemical shrinkage and modulus evolution at arbitrary temperatures

  • Author

    Wang, Yong ; Han, Bongtae

  • Author_Institution
    Dept. of Mech. Eng., Univ. of Maryland, College Park, MD, USA
  • fYear
    2010
  • fDate
    1-4 June 2010
  • Firstpage
    1262
  • Lastpage
    1265
  • Abstract
    A generalized hybrid modeling is proposed to estimate the chemical shrinkage and modulus evolutions at arbitrary temperatures. Using the existing curing kinetics modeling, a theoretical formulation is developed to provide a mathematical relationship between the evolution properties at arbitrary temperatures and those obtained at a reference temperature. The evolution properties at the reference temperature are obtained first by the fiber Bragg grating (FBG) sensor method. The activation energy is determined from the supplementary curing extent data obtained at various temperatures using the differential scanning calorimeter (DSC). The shift factor is then calculated from the activation energy, and the evolution properties at a temperature range of interest are estimated from the reference properties.
  • Keywords
    curing; differential scanning calorimetry; elastic moduli; polymerisation; polymers; shrinkage; activation energy; arbitrary temperatures; chemical shrinkage; curing kinetics modeling; differential scanning calorimeter; evolution properties; fiber Bragg grating sensor method; generalized hybrid modeling; modulus evolution; reference temperature; shift factor; supplementary curing extent data; Bragg gratings; Chemical engineering; Chemical sensors; Curing; Fiber gratings; Kinetic theory; Mathematical model; Polymers; Temperature sensors; Wavelength measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-6410-4
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2010.5490652
  • Filename
    5490652