DocumentCode
2728443
Title
RF MEMS wafer-level packaging using solder paste by via filling process
Author
Jung, Sunghae ; Lee, Myunglae ; Moon, Jong-Tae
Author_Institution
Convergence & Components & Mater. Res. Lab., ETRI, Daejeon, South Korea
fYear
2010
fDate
1-4 June 2010
Firstpage
1996
Lastpage
2000
Abstract
In this paper, the design, fabrication technology, and experimental evaluation of the RF frequency performance of a new type of solder paste via filled through-wafer interconnects in silicon substrates are presented
Keywords
Chemical lasers; Copper; Etching; Filling; Radio frequency; Radiofrequency microelectromechanical systems; Silicon; Switches; Wafer bonding; Wafer scale integration; rf mems; solder; switch; via;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location
Las Vegas, NV, USA
ISSN
0569-5503
Print_ISBN
978-1-4244-6410-4
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2010.5490672
Filename
5490672
Link To Document