Title :
glassPack — A 3D glass based interposer concept for SiP with integrated optical interconnects
Author :
Schröder, H. ; Brusberg, L. ; Erxleben, R. ; Ndip, I. ; Töpper, M. ; Nissen, N.F. ; Reichl, H.
Author_Institution :
Fraunhofer IZM, Berlin, Germany
Abstract :
We introduce thin glass for electrical-optical integration on module level. Glass is regarded as promising material for high frequency wiring to drive the e/o components having additional advantages in terms of transparency, waveguide and lens integration capability and PCB integration. Modeling results of vertical and horizontal electrical interconnects show the suitability for certain configurations. The integration schemes will be discussed and experimental results from thin film deposition, laser drilling of through vias and ion exchange for optical waveguides will be presented.
Keywords :
Frequency; Glass; Laser modes; Lenses; Optical interconnections; Optical materials; Optical waveguide components; Optical waveguides; Sputtering; Wiring;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
978-1-4244-6410-4
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2010.5490760
