• DocumentCode
    2730441
  • Title

    An improved interconnect noise methodology for reduced pessimism using dAP model

  • Author

    Mun, Wong Wai ; Marzuki, Arjuna Bin ; Honn, Wong Yew

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Univ. Sains Malaysia (USM), Nibong Tebal, Malaysia
  • fYear
    2011
  • fDate
    25-28 Sept. 2011
  • Firstpage
    289
  • Lastpage
    294
  • Abstract
    Noise simulators were never accurate estimators of interconnect noise values as the switching pattern, slew and delay in a cluster of adjacent nets were never addressed. In modern signal integrity flows, a very high level of pessimism is incorporated into the noise methodology to augment the lack of accuracy, such as lumped aggression, noise ramps and lumped slews. Desirably, such pessimistic assumptions are much easier to compute hence efficient on simulation runtime, but often than ever it will result in an overdesigned chip. This paper discusses a recipe to reduce pessimism in interconnect noise methodologies by effectively modeling the downstream degradation on the aggression line. We will be presenting an aggression slew estimation method derived from the Elmore delay, which has less than 0.8% error compared to SPICE simulations and is inclined towards the higher slew bound when compared to both Elmore´s delay and SPICE. We also show that the dAP method reduces the average reported noise by 5% even when we account for victim-aggressor reverse aggression issues.
  • Keywords
    delays; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; Elmore delay; SPICE simulation; adjacent net cluster; aggression line downstream degradation; aggression slew estimation method; dAP model; interconnect noise methodology; lumped aggression; lumped slew; noise ramp; noise simulator; overdesigned chip; pessimism reduction; signal integrity flow; switching pattern; victim-aggressor reverse aggression issue; Computational modeling; Degradation; Delay; Mathematical model; Metals; Noise; SPICE; Elmore delay; Noise simulation; RC network; crosstalk; interconnect noise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics and Applications (ISIEA), 2011 IEEE Symposium on
  • Conference_Location
    Langkawi
  • Print_ISBN
    978-1-4577-1418-4
  • Type

    conf

  • DOI
    10.1109/ISIEA.2011.6108717
  • Filename
    6108717