DocumentCode :
2730855
Title :
Voltage Acceleration of TBD and Its Correlation to Post Breakdown Conductivity of N- and P-Channel MOSFETs
Author :
Röhner, M. ; Kerber, A. ; Kerber, M.
Author_Institution :
Infineon Technol., Munich
fYear :
2006
fDate :
26-30 March 2006
Firstpage :
76
Lastpage :
81
Abstract :
The gate oxide breakdown behavior of advanced n- and p-channel CMOS devices was thoroughly investigated from the time range of electrical overstress events (mus) to package level test conditions (106 s). The voltage acceleration follows the power-law-model over 12 decades in time. In addition the current-voltage driven wear out was studied for linear and non-linear driver elements. It was found that the evolution of the post breakdown conductivity strongly depends on the current limitation and the associated voltage drop across the driving stage. The post breakdown evolution can be described by the intrinsic voltage acceleration model
Keywords :
MOSFET; semiconductor device breakdown; semiconductor device reliability; MOSFET; TBD; current limitation; dielectric breakdown; electrical overstress events; oxide reliability; package level test conditions; post breakdown conductivity; voltage acceleration; Acceleration; Breakdown voltage; Conductivity; Dielectric breakdown; Electric breakdown; Life estimation; MOSFETs; Packaging; Pulse measurements; Stress; dielectric breakdown; oxide reliability; voltage accelerations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9498-4
Electronic_ISBN :
0-7803-9499-2
Type :
conf
DOI :
10.1109/RELPHY.2006.251194
Filename :
4017135
Link To Document :
بازگشت