• DocumentCode
    27317
  • Title

    A SPICE Model of Resistive Random Access Memory for Large-Scale Memory Array Simulation

  • Author

    Haitong Li ; Peng Huang ; Bin Gao ; Bing Chen ; Xiaoyan Liu ; Jinfeng Kang

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • Volume
    35
  • Issue
    2
  • fYear
    2014
  • fDate
    Feb. 2014
  • Firstpage
    211
  • Lastpage
    213
  • Abstract
    A SPICE model of oxide-based resistive random access memory (RRAM) for dc and transient behaviors is developed based on the conductive filament evolution model and is implemented in large-scale array simulation. The simulations of one transistor-one resistor RRAM array up to 16 kb with wire resistance (Rwire) and capacitance (Cwire) indicate that: 1) resistance-capacitance delay during RESET and leakage current during SET have significant impact on write operations; 2) with array size enlarging, the power dissipation increases during RESET but decreases during SET; and 3) the increased Rwire and Cwire lead to the degradation of high resistance state and the fluctuation of low resistance state, respectively.
  • Keywords
    SPICE; leakage currents; random-access storage; wires (electric); RESET; SPICE model; conductive filament evolution; dc behavior; large-scale array; large-scale memory array simulation; leakage current; one transistor-one resistor RRAM array; oxide-based resistive random access memory RRAM; power dissipation; resistance-capacitance delay; transient behavior; wire capacitance; wire resistance; Arrays; Integrated circuit modeling; Microprocessors; Power dissipation; Resistance; SPICE; Circuit simulation; SPICE model; memory array; power dissipation; resistive random access memory (RRAM);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2013.2293354
  • Filename
    6684558