Electrical Breakdown Response for Multiple-Gap MEMS Structures

We characterize the electrical breakdown response for planar structures, fabricated using microelectromechanical systems (MEMS) methods and materials, to enable design of high voltage microswitches. Electrode configurations that use multiple air gaps provide voltage division between electrodes and allow large voltage holdoff values in microswitch contact configurations with short actuation distances. The comparatively large benefits gained from very small air gaps (4 to 7 mum) help to enable high holdoff values, particularly when multiple gaps in this range are added in series. The capacitive effect in multiple gaps can lower breakdown levels, but sufficient electrode spacing reduces this effect