Title :
Coffin-Manson Equation determination for Sn-Zn Based Lead-Free Solder Joints
Author :
Sun, Peng ; Andersson, Cristina ; Cheng, Zhaonian ; Lai, Zonghe ; Shangguan, Dongkai ; Liu, Johan
Author_Institution :
Sino-Swedish Microsystem Integration Technol. Centre, Shanghai Univ.
Abstract :
The 3D FE simulation performed in this work was used to deal with the experimental measured data, and to get the Coffin-Manson equation for lifetime prediction. Low cycle fatigue tests and FE simulations were performed on Sn-8Zn-3Bi lead free solder joints, and the Sn-37Pb eutectic solder was used as reference. The Coffin-Manson equation for the Sn-8Zn-3Bi lead free solder was fitted from the experimental measured lifetime and the shear strain calculated according to the equation Nf = 0.0294(Deltagamma)-2.833 , where the Nf is the number of cycles to failure and Deltagamma is the plastic shear strain
Keywords :
bismuth alloys; eutectic alloys; finite element analysis; life testing; soldering; solders; tin alloys; zinc; 3D finite element simulation; Coffin-Manson equation; Sn-Pb; Sn-Zn-Bi; cycles to failure; eutectic solder; lead-free solder joints; low cycle fatigue tests; plastic shear strain; Environmentally friendly manufacturing techniques; Equations; Fatigue; Iron; Lead; Performance evaluation; Predictive models; Soldering; Strain measurement; Testing;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9292-2
Electronic_ISBN :
0-7803-9293-0
DOI :
10.1109/HDP.2005.251421
