An 8192-point fast fourier transform 3D-IC case study

Author

Davis, W. Rhett ; Sule, Ambarish M. ; Franzon, Paul D.

Author_Institution

Dept. of Electr. & Comput. Eng. (ECE), North Carolina State Univ. (NCSU), Raleigh, NC

fYear

2008

fDate

10-13 Aug. 2008

Firstpage

438

Lastpage

441

Abstract

3D stacking and integration can provide system advantages. This paper explores an application driver for 3D ICs. Interconnect-rich applications especially benefit, sometimes up to the equivalent of two technology nodes. Another promising application area is that of logic-on-memory. This paper presents a case studies of an 8192-point fast Fourier transform (FFT) processor in order to quantify the benefit of the through-silicon vias in an available 180 nm 3D process. The FFT shows a 22% reduction in cycle-time, coupled with an 18% reduction in energy per transform.

Keywords

fast Fourier transforms; integrated circuit design; integrated circuit interconnections; microprocessor chips; 3D stacking; 3D-integrated circuit; FFT processor; fast Fourier transform; interconnect-rich applications; logic-on-memory; size 180 nm; through-silicon vias; Costs; Delay; Design automation; Fast Fourier transforms; Field programmable gate arrays; Integrated circuit interconnections; Stacking; Three-dimensional integrated circuits; Through-silicon vias; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 2008. MWSCAS 2008. 51st Midwest Symposium on

Conference_Location

Knoxville, TN

ISSN

1548-3746

Print_ISBN

978-1-4244-2166-4

Electronic_ISBN

1548-3746

Type

conf

DOI

10.1109/MWSCAS.2008.4616830

Filename

4616830