Title :
Global Trend in Electronics Manufacturing
Author :
Shangguan, Dongkai
Author_Institution :
Dr., Flextronics
Abstract :
The global trend in electronics manufacturing was reviewed in this paper. First, the global landscape for lead-free soldering and environmental compliance was outlined. This was followed by a discussion of the packaging and assembly technologies in the electronics industry. The impact on the supply chain was also discussed
Keywords :
assembling; electron device manufacture; electronic equipment manufacture; electronics industry; electronics packaging; environmental factors; soldering; supply chains; assembly technology; electronics industry; electronics manufacturing global trend; environmental compliance; lead-free soldering; packaging technology; supply chain; Assembly; Consumer electronics; Costs; Electronic waste; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Recycling; Soldering; Supply chains;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9292-2
Electronic_ISBN :
0-7803-9293-0
DOI :
10.1109/HDP.2005.251430
