Title :
Solder joints reliability of surface mounted components: a requirement for new quality insurance procedures
Author :
Auray, M. ; Catherine, P. ; Joly, J.
Author_Institution :
BULL, Les Clayes Sous Bois, France
Abstract :
Thermomechanical simulation of solder joints of J-leaded components has permitted optimizations of the mounting process and provided confidence and time-saving before running qualification tests. The difficulties and the cost of performing solder joint inspection have led to their replacement by novel quality insurance procedures. The first experimental results are promising
Keywords :
inspection; printed circuit testing; quality control; reliability; soldering; surface mount technology; J-leaded components; QC; SMT; cost; inspection; qualification tests; quality insurance; reliability; solder joints; surface mounted components; thermomechanical simulation; Capacitive sensors; Inorganic materials; Insurance; Joining materials; Lead; Shape; Soldering; Temperature; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location :
Neuilly sur Seine
DOI :
10.1109/EEMTS.1988.75971
