• DocumentCode
    27366
  • Title

    Heavy Aluminum Wire Wedge Bonding Strength Prediction Using a Transducer Driven Current Signal and an Artificial Neural Network

  • Author

    Fuliang Wang ; Junhui Li ; Shaohua Liu ; Lei Han

  • Author_Institution
    Sch. of Mech. & Electr. Eng., Central South Univ., Changsha, China
  • Volume
    27
  • Issue
    2
  • fYear
    2014
  • fDate
    May-14
  • Firstpage
    232
  • Lastpage
    237
  • Abstract
    Heavy aluminum wire wedge bonding is commonly used in the packages of power electronic devices. In this paper, a heavy aluminum wire wedge bonding strength prediction system was developed. In this system, the driving current of the transducer system was recorded by a data acquisition system, decomposed, and analyzed using a wavelet model. The fundamental frequency component was extracted, and seven characteristics (five in the time domain and two in the frequency domain) were obtained from the experimental observations. An artificial neural network using back-propagation as training (using 1440 bonding samples) was used; 2200 bonding test samples were then used to verify the performance of the bonding strength prediction system. Experimental results show that this method can be used to accurately predict the shear strength of heavy aluminum wire wedge bonding.
  • Keywords
    aluminium alloys; backpropagation; electronic engineering computing; electronics packaging; lead bonding; mechanical strength; neural nets; transducers; wavelet transforms; Al; artificial neural network training; backpropagation; bonding test samples; data acquisition system; fundamental frequency component; heavy aluminum wire wedge bonding strength prediction system; power electronic devices; shear strength; transducer driven current signal; wavelet model; Acoustics; Aluminum; Artificial neural networks; Bonding; Transducers; Vibrations; Wires; Heavy aluminum wire wedge bonding; artificial neural network (ANN); bonding strength prediction; driver current; transducer system;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2014.2310223
  • Filename
    6762998