Title :
Reworking Lead-Free Array Packages on Double Sided Printed Circuit Boards
Author_Institution :
Market Dev., OK Int., Garden Grove, CA
Abstract :
Whether using lead-bearing or lead-free processes, and whether reworking conventional or array package components, the principal steps in rework, (desoldering, removal, site cleaning and reattachment) remain largely the same. This article proposes to focus on heating, the biggest issue introduced by lead-free rework, and how best to reflow array package components on large double-sided printed circuit boards (PCBs).
Keywords :
ball grid arrays; heating; printed circuit manufacture; printed circuits; reflow soldering; BGA; PCB; array package components; desoldering; double sided printed circuit board; heating; reattachment process; reflow; removal process; reworking; site cleaning; Bridge circuits; Circuit faults; Environmentally friendly manufacturing techniques; Lead; Packaging; Pressure control; Printed circuits; Size control; Temperature control; Throughput;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
DOI :
10.1109/IMPACT.2008.4783822
