Halogen-Free Debate on Solderpaste : IPC Classification and Application

Halogen-free requirement¹ in PCBA and in related materials has been gaining momentum in recent months. Major computer manufacturers had made announcements about intentions to go bromine-free in the next two years^{2, 3}. Halogen-free started from RoHS banned substances on PBB⁴ and PBDE⁵ initially, however, it has evolved to a broader coverage of detectable halogen level per IEC 61249-2-21⁶, JPCA-ES-01-2003⁷, and IPC-4101B⁸ specifications. Currently, solderpaste formulation is classified by IPC J-STD-004A⁹ standard, with permissible and declared halogen/halide level. This paper compares and contrasts the current IPC, J-STD-004A standard and the impact of halogen-free requirements on the classification. A study is also done to examine whether solderability of halogen-free solderpaste formulas is lowered versus halogenated formulas.