Title :
Application of wafer direct bonding technology to optical nonreciprocal devices
Author :
Mizumoto, Tetsuya ; Takei, Ryohei
Author_Institution :
Dept. Electr. & Electron. Eng., Tokyo Inst. of Technol., Tokyo, Japan
Abstract :
The wafer direct bonding technology enables one to integrate dissimilar crystals like magneto-optic garnet on Si and III-V semiconductors. Optical nonreciprocal devices are fabricated based on the wafer bonding technology.
Keywords :
III-V semiconductors; arsenic compounds; bonding processes; cerium; elemental semiconductors; gallium compounds; garnets; indium compounds; magneto-optical isolators; optical fabrication; optical materials; optical waveguides; silicon; silicon-on-insulator; yttrium compounds; GaInAsP; III-V semiconductors; Si; YIG:Ce; dissimilar crystals; magnetooptic garnet; optical nonreciprocal devices; wafer direct bonding technology; Bonding; Isolators; Magnetooptic devices; Optical device fabrication; Optical interferometry; Optical waveguides; Silicon;
Conference_Titel :
Winter Topicals (WTM), 2011 IEEE
Conference_Location :
Keystone, CO
Print_ISBN :
978-1-4244-8428-7
DOI :
10.1109/PHOTWTM.2011.5730074
