Title :
Devices to Improve Coronary Artery Bypass Grafting (CABG) Surgery
Author :
Hoagland, B.D. ; Ryan, T.P. ; Durrani, A.K. ; Burton, L.J. ; Tumkur, S.M.
Author_Institution :
Department of Biomedical Engineering, Vanderbilt University, Nashville, TN, USA; F. Edward Hébert School of Medicine, Uniformed Services University of the Health Sciences, Bethesda, MD, USA
Abstract :
As off-pump coronary artery bypass grafting becomes the method of choice for cardio-thoracic surgeons, it has become apparent that the facilitation of coronary artery anastomosis on a beating heart needs to be addressed by improved instrumentation. We propose an intraluminal anastomosis device used in conjunction with a biologic-glue to eliminate suturing and serve as a scaffold for constructing stable anastomoses. The device will continue to serve as an eluting stent postoperatively. The simple technique of using the device and the adhesive will require 5 minutes or less for anastomosis. Moreover, we introduce a novel parallel port vacuum stabilizer foot equipped with a uniform lateral tension inducing turnbuckle mechanism to be used with off-pump stabilization systems. A proposed in vitro protocol details using saphenous vein segments and coronary arteries to test the patency of multiple end-to-side grafts. A pressure transducer will be attached to the graft to monitor flow characteristics. An in vivo protocol details construction of anastomoses during off-pump coronary artery bypass grafting in pigs using the anastomosis device, the turnbuckle vacuum foot, and the biologic-glue. Anastomosis patency will be evaluated intraoperatively and one month postoperatively. Furthermore, the graft site will be examined via flow measurement, angiography, and histological analysis.
Keywords :
anastomosis device; coronary artery bypass grafting; off-pump CABG; restinosis; Arteries; Cardiology; Foot; Heart; In vitro; Instruments; Protocols; Surgery; Vacuum systems; Veins;
Conference_Titel :
Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
Print_ISBN :
0-7803-8439-3
DOI :
10.1109/IEMBS.2004.1404063