Title :
Limitations, Innovations, And Challenges Of Circuits & Devices Into Half-Micron And Beyond
Author_Institution :
Hitachi Ltd.
fDate :
May 30 1991-June 1 1991
Keywords :
Breakdown voltage; Power dissipation; Semiconductor materials; Signal processing; Switching circuits; Technological innovation; Temperature; Thermal resistance; Very large scale integration; Virtual manufacturing;
Conference_Titel :
VLSI Circuits, 1991. Digest of Technical Papers. 1991 Symposium on
Conference_Location :
Oiso, Japan
DOI :
10.1109/VLSIC.1991.760069
