DocumentCode :
2743662
Title :
A Green´s function analysis of Schottky barrier diodes in strip-coupled transversal signal processing architectures
Author :
Fliegel, F.M.
Author_Institution :
Motorola Gov. Electron. Group, Scottsdale, AZ, USA
fYear :
1990
fDate :
4-7 Dec 1990
Firstpage :
259
Abstract :
Theoretical and experimental results on Schottky barrier diodes in strip-coupled transversal signal processing architectures are presented. The need for a semiinsulating substrate for efficient SAW (surface acoustic wave) transduction and effective isolation of active circuit elements from one another, together with the need for high spatial sampling rates, is discussed. In ACT (acoustic charge transport) devices, the SAW used for transport of charge biases these Schottky diodes such that the diodes are laterally isolated from one another. This results in a strong dependence of nonlinear efficiency on both frequency and diode length. Substantial effects of DC bias on diode efficiency, and hence on convolver efficiency, are observed in ACT-based architectures, due to the bias induced by the clocking signal(s) present in such devices
Keywords :
Green´s function methods; Schottky-barrier diodes; acoustic signal processing; acoustoelectric devices; piezoelectric transducers; surface acoustic wave devices; ultrasonic delay lines; ultrasonic transducers; ACT devices; ACT-based architectures; Green´s function analysis; Schottky barrier diodes; acoustic charge transport; active circuit elements; convolver efficiency; effective isolation; effects of DC bias; efficient SAW transduction; high spatial sampling rates; nonlinear efficiency; semiinsulating substrate; strip-coupled transversal signal processing architectures; Acoustic devices; Acoustic signal processing; Acoustic waves; Active circuits; Green´s function methods; Schottky barriers; Schottky diodes; Signal sampling; Surface acoustic wave devices; Surface acoustic waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 1990. Proceedings., IEEE 1990
Conference_Location :
Honolulu, HI
Type :
conf
DOI :
10.1109/ULTSYM.1990.171364
Filename :
171364
Link To Document :
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