Nondestructive evaluation of delamination in IC packages by millimeter-waves

Author

Yang Ju ; Saka, M. ; Abe, H.

Author_Institution

Dept. of Mech. Eng., Tohoku Univ., Sendai, Japan

fYear

2000

fDate

12-15 Sept. 2000

Firstpage

421

Lastpage

422

Abstract

A method to evaluate delamination in IC packages by millimeter-wave technique was studied. An open-ended coaxial line sensor was used as source and also as receiver of millimeter-wave signal that was transmitted into and reflected from the packages. The phase of the reflection coefficient causes a shift due to the presence of the delamination. The phase shift of the reflection coefficient in the cases of with and without delamination was proposed to be used to evaluate the delamination.

Keywords

delamination; inspection; integrated circuit packaging; microwave reflectometry; millimetre wave measurement; plastic packaging; IC packages; delamination; microwave inspection; millimeter-wave technique; nondestructive evaluation; open-ended coaxial line sensor; package integrity assessment; phase shift; plastic encapsulant; reflection coefficient; Acoustic signal detection; Apertures; Coaxial components; Delamination; Integrated circuit packaging; Millimeter wave technology; Phase measurement; Reflection; Surface acoustic waves; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Infrared and Millimeter Waves, 2000. Conference Digest. 2000 25th International Conference on

Conference_Location

Beijing, China

Print_ISBN

0-7803-6513-5

Type

conf

DOI

10.1109/ICIMW.2000.893089

Filename

893089