Title :
Nondestructive evaluation of delamination in IC packages by millimeter-waves
Author :
Yang Ju ; Saka, M. ; Abe, H.
Author_Institution :
Dept. of Mech. Eng., Tohoku Univ., Sendai, Japan
Abstract :
A method to evaluate delamination in IC packages by millimeter-wave technique was studied. An open-ended coaxial line sensor was used as source and also as receiver of millimeter-wave signal that was transmitted into and reflected from the packages. The phase of the reflection coefficient causes a shift due to the presence of the delamination. The phase shift of the reflection coefficient in the cases of with and without delamination was proposed to be used to evaluate the delamination.
Keywords :
delamination; inspection; integrated circuit packaging; microwave reflectometry; millimetre wave measurement; plastic packaging; IC packages; delamination; microwave inspection; millimeter-wave technique; nondestructive evaluation; open-ended coaxial line sensor; package integrity assessment; phase shift; plastic encapsulant; reflection coefficient; Acoustic signal detection; Apertures; Coaxial components; Delamination; Integrated circuit packaging; Millimeter wave technology; Phase measurement; Reflection; Surface acoustic waves; Thermal stresses;
Conference_Titel :
Infrared and Millimeter Waves, 2000. Conference Digest. 2000 25th International Conference on
Conference_Location :
Beijing, China
Print_ISBN :
0-7803-6513-5
DOI :
10.1109/ICIMW.2000.893089
