DocumentCode :
2747511
Title :
Organizers & Sponsors
fYear :
2008
fDate :
22-24 Oct. 2008
Firstpage :
337
Lastpage :
337
Abstract :
Lists the sponsors of this conference.
Keywords :
Chemical industry; Chemical technology; Components, packaging, and manufacturing technology; Electronics industry; Plastic packaging; Plastics industry; Printed circuits; Semiconductor device packaging; Societies; Surface-mount technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3620-0
Electronic_ISBN :
978-1-4244-3621-7
Type :
conf
DOI :
10.1109/EMAP.2008.4784297
Filename :
4784297
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2747511
بازگشت