DocumentCode :
2747526
Title :
Committee
fYear :
2008
fDate :
22-24 Oct. 2008
Firstpage :
338
Lastpage :
339
Abstract :
Provides a listing of current committee members.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3620-0
Type :
conf
DOI :
10.1109/EMAP.2008.4784298
Filename :
4784298
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2747526
