• DocumentCode
    2747526
  • Title

    Committee

  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Firstpage
    338
  • Lastpage
    339
  • Abstract
    Provides a listing of current committee members.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3620-0
  • Type

    conf

  • DOI
    10.1109/EMAP.2008.4784298
  • Filename
    4784298
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2747526