• DocumentCode
    2750002
  • Title

    Meeting the EuP Directive: Life Cycle Assessment Information Sharing as Opportunity for Global Compliance

  • Author

    Matthews, H. Scott

  • Author_Institution
    Carnegie Mellon Univ., Pittsburgh
  • fYear
    2007
  • fDate
    7-10 May 2007
  • Firstpage
    155
  • Lastpage
    158
  • Abstract
    The EU´s directive 2005/32/EC seeks to set eco-design standards for the life cycle of energy-using products (EuP). While not yet formally ratified like the WEEE and RoHS standards, this directive is expected to ride the same wave of momentum and go into effect in the next few years. WEEE and RoHS have gone beyond Europe and had similar application in other parts of the world, thus global EuP-like directives are also likely. If manufacturers want to continue to comply with this new wave of regulation, they will need to start exploring existing tools. A key need for compliance is the creation of global networks of shared environmental and energy profiles for products, which could be led by the electronics industry. This paper discusses developments in Life Cycle Assessment (LCA) over the last decade and how it can be a key tool in meeting EuP- like standards, currently planned to go into effect in 2007.
  • Keywords
    design for disassembly; electronic products; electronics industry; hazardous materials; remaining life assessment; standards; waste management; EU directive 2005/32/EC; Europe; RoHS standards; WEEE standards; ecodesign standards; electronics industry; energy-using products; global EuP-like directives; global compliance; global networks; life cycle assessment information sharing; Adders; Design engineering; Electronic waste; Electronics industry; Europe; Manufacturing; Meeting planning; Power engineering and energy; Public policy; Standards development; Europe; compliance; computers; energy; life cycle assessment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics & the Environment, Proceedings of the 2007 IEEE International Symposium on
  • Conference_Location
    Orlando, FL
  • ISSN
    1095-2020
  • Print_ISBN
    1-4244-0861-X
  • Type

    conf

  • DOI
    10.1109/ISEE.2007.369385
  • Filename
    4222874