Title :
Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (IEEE Cat. No.89CH2688-0)
Abstract :
Presents the cover from the proceedings of this conference.
Keywords :
VLSI; cooling; heat transfer; infrared imaging; packaging; printed circuits; semiconductor technology; surface mount technology; temperature measurement; thermal analysis; IR surface-temperature measurements; MOS integrated circuits; VF tester; VLSI plastic package; buried resistors; calibration; chip packages; cooling; electronic cooling; encapsulation; finite-element models; flow; four-layer infinite plate structure; hybrid integrated circuits; integration algorithm; microwave bipolar devices; mixing; packaging; periodically pulsed fluid; rectangular cavities; semiconductor devices; surface mount plastic packages; thermal analysis; thermal characteristics; thermal diagnostics; thermal impedance; thermal modeling;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/STHERM.1989.76085
