Title :
Process-Integration Challenges with Up-To-Date Modulation of Scaling Laws
Author_Institution :
Dept. of Process Integration, Fujitsu Ltd., Kuwana
Abstract :
CMOS scaling laws have already lost the physical bases, and the merest results induced by scaling laws are still utilized for requirements from technology users. In this paper, the actual situation of CMOS shrinkage and a forecast are discussed
Keywords :
CMOS integrated circuits; CMOS scaling laws; CMOS shrinkage; process-integration challenges; CMOS technology; Copper; Degradation; Guidelines; High K dielectric materials; High-K gate dielectrics; Integrated circuit interconnections; Integrated circuit technology; Voltage; Wire;
Conference_Titel :
Advanced Thermal Processing of Semiconductors, 2006. RTP '06. 14th IEEE International Conference on
Conference_Location :
Kyoto
Print_ISBN :
1-4244-0648-X
Electronic_ISBN :
1-4244-0649-8
DOI :
10.1109/RTP.2006.367974
