• DocumentCode
    2754875
  • Title

    Applying algorithm model as virtual sensors for searching latent issues

  • Author

    Niu, H.J. ; Chang, C.J.

  • Author_Institution
    Grad. Inst. of Manage. Sci., Tamkang Univ., Taipei, Taiwan
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    569
  • Lastpage
    573
  • Abstract
    I.C. manufacturing comprises hundreds of processes such as diffusion, lithography, thin film and etching which are performed on hundreds of machines. Most of them can be easily identified and analyzed, which is attributed to explicit knowledge. However, some ambiguous information still exists, which is attributed to tacit knowledge. Some of critical information is always neglected and conduct the wrong R&D direction. Applying multivariate statistical analysis as virtual sensors can generate specific results corresponding to the core of the equipment or process, and gets rid of non-accurate information using experience rating. That provides a way to guide R&D engineers and to bring to light the essence of the whole process. In summary, process stabilization and cost saving are the main advantages of virtual sensors.
  • Keywords
    cost reduction; integrated circuit manufacture; knowledge management; research and development management; statistical analysis; IC manufacturing; R&D engineer; R&D management; algorithm model; cost saving; experience rating; knowledge management; latent issue; multivariate statistical analysis; process stabilization; tacit knowledge; virtual sensor; Chemical sensors; Knowledge management; Magnetic sensors; Optical sensors; Plasma applications; Plasma chemistry; Plasma temperature; Research and development; Research and development management; Thin film sensors; I.C. Manufacturing; Knowledge Management; Multivariate Statistical Analysis; R&D Management; Virtual Sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management of Innovation and Technology (ICMIT), 2010 IEEE International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-6565-1
  • Electronic_ISBN
    978-1-4244-6566-8
  • Type

    conf

  • DOI
    10.1109/ICMIT.2010.5492758
  • Filename
    5492758