• DocumentCode
    2755872
  • Title

    Manufacturing of complex systems by a discrete wiring interconnection technology

  • Author

    Nakahara, H. ; Messner, G. ; Buck, T.

  • Author_Institution
    Kollmorgen Corp., Melville, NY, USA
  • fYear
    1989
  • fDate
    26-28 Apr 1989
  • Firstpage
    40
  • Lastpage
    47
  • Abstract
    The authors describe the method and structures used to date in the production of high-performance mainframes and supercomputers, as well as some techniques proposed for the future. They analyze the main forces, needs, and constraints driving the selection of the methods presently used for manufacturing these computers. They assess the improved manufacturability of such systems which could be provided by the application of discrete wiring interconnection methods, specifically, the Microwire process. They provide wireability, electrical, and thermal performance data for Microwire boards and cite examples of their application to the manufacture of extremely dense, high-speed systems
  • Keywords
    digital computers; electronic equipment manufacture; packaging; printed circuits; Microwire process; circuit boards; complex systems; computers; crosstalk; discrete wiring; electrical performance; high density systems; high-performance mainframes; high-speed systems; interconnection technology; manufacturing; production; supercomputers; thermal performance data; wireability; Application specific integrated circuits; Atherosclerosis; Computer aided manufacturing; Costs; Electronics packaging; Equations; Integrated circuit interconnections; Integrated circuit packaging; Production; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
  • Conference_Location
    Nara
  • Type

    conf

  • DOI
    10.1109/IEMTS.1989.76106
  • Filename
    76106