Title :
Short-distance interconnection bandwidth: the scarce resource
Author_Institution :
Defense Adv. Res. Projects Agency, Arlington, VA, USA
Abstract :
We discuss the progress, challenges, and projections for short-distance optical interconnections. It will focus on hardware packaging issues. The paper will also introduce the notion that new systems architectures are needed to take advantage of the high communication bandwidth available in the new modality of interconnection
Keywords :
VLSI; integrated circuit packaging; multichip modules; optical interconnections; hardware packaging issues; high communication bandwidth; interconnection modality; short-distance interconnection bandwidth; short-distance optical interconnections; systems architectures; Bandwidth; Fiber lasers; Logic; Optical arrays; Optical interconnections; Photonics; Semiconductor lasers; Silicon; Stimulated emission; Vertical cavity surface emitting lasers;
Conference_Titel :
Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE
Conference_Location :
Rio Grande
Print_ISBN :
0-7803-5947-X
DOI :
10.1109/LEOS.2000.893892
