Title :
Progress towards low-cost modules for SMT
Author :
Rehm, W. ; Mayer, H.P.
Author_Institution :
Alcatel Corp. Res. Center, Stuttgart, Germany
Abstract :
We have presented a new concept for low cost optoelectronic modules. Our results demonstrate the capability of lasers with a plastic package, that are compatible with automatic surface mounting. They can operate even at high temperatures without Peltier cooling
Keywords :
integrated optoelectronics; modules; plastic packaging; surface mount technology; high temperature operation; laser; optoelectronic module; plastic package; surface mount technology; Connectors; Costs; Fiber lasers; Optical fiber communication; Optical fibers; Packaging; Protection; Silicon; Soldering; Surface-mount technology;
Conference_Titel :
Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE
Conference_Location :
Rio Grande
Print_ISBN :
0-7803-5947-X
DOI :
10.1109/LEOS.2000.894053
