DocumentCode
2760145
Title
Sensors technologies for automotive applications
Author
Acqua, R. Dell ; Timossi, G.M.
Author_Institution
Marelli Autronica SpA, Pavia, Italy
fYear
1989
fDate
26-28 Apr 1989
Firstpage
196
Lastpage
200
Abstract
Sensor requirements and sensor manufacturing technologies for automotive applications are surveyed. It is predicted that silicon integrated and/or smart sensors will be widely used when they are standardized and produced in high volumes. Nevertheless, their lengthy development time and high cost will, in many circumstances, restrain, limit, or at least delay their use. It is suggested that some kinds of hybrid integration (for example, a silicon transduction element on a thick-film hybrid or a silicon transduction element plus a silicon chip with signal conditioning electronics) can be expected in the not-too-far future. In this framework it seems reasonable to foresee that thick-film technology will be of great importance for these components
Keywords
automotive electronics; electric sensing devices; thick film circuits; automotive applications; cost; development time; sensor manufacturing technologies; sensor technology; signal conditioning electronics; smart sensors; thick-film hybrid; thick-film technology; transduction element; Automotive applications; Control systems; Costs; Electronics packaging; Intelligent sensors; Logic functions; Microprocessors; Sensor phenomena and characterization; Sensor systems; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location
Nara
Type
conf
DOI
10.1109/IEMTS.1989.76137
Filename
76137
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