• DocumentCode
    2760145
  • Title

    Sensors technologies for automotive applications

  • Author

    Acqua, R. Dell ; Timossi, G.M.

  • Author_Institution
    Marelli Autronica SpA, Pavia, Italy
  • fYear
    1989
  • fDate
    26-28 Apr 1989
  • Firstpage
    196
  • Lastpage
    200
  • Abstract
    Sensor requirements and sensor manufacturing technologies for automotive applications are surveyed. It is predicted that silicon integrated and/or smart sensors will be widely used when they are standardized and produced in high volumes. Nevertheless, their lengthy development time and high cost will, in many circumstances, restrain, limit, or at least delay their use. It is suggested that some kinds of hybrid integration (for example, a silicon transduction element on a thick-film hybrid or a silicon transduction element plus a silicon chip with signal conditioning electronics) can be expected in the not-too-far future. In this framework it seems reasonable to foresee that thick-film technology will be of great importance for these components
  • Keywords
    automotive electronics; electric sensing devices; thick film circuits; automotive applications; cost; development time; sensor manufacturing technologies; sensor technology; signal conditioning electronics; smart sensors; thick-film hybrid; thick-film technology; transduction element; Automotive applications; Control systems; Costs; Electronics packaging; Intelligent sensors; Logic functions; Microprocessors; Sensor phenomena and characterization; Sensor systems; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
  • Conference_Location
    Nara
  • Type

    conf

  • DOI
    10.1109/IEMTS.1989.76137
  • Filename
    76137