Title :
Connectorized packaging for PLC devices
Author_Institution :
NTT-East Res. & Dev. Center, Chiba, Japan
Abstract :
Recent development results of the interconnection for PLC devices are presented. After describing some requirements of the packaging for PLC devices, connectorization methods and some examples of the packaging are given
Keywords :
optical interconnections; packaging; PLC device; connectorized packaging; interconnection; Connectors; Integrated circuit interconnections; Optical crosstalk; Optical fiber devices; Optical planar waveguides; Optical waveguide components; Optical waveguides; Packaging machines; Planar waveguides; Programmable control;
Conference_Titel :
Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE
Conference_Location :
Rio Grande
Print_ISBN :
0-7803-5947-X
DOI :
10.1109/LEOS.2000.894054
