Pin Brazing Technology For A High Performance Aluminum Nitride Package

Author

Iyogi, K. ; Yamakawa, K. ; Koiwa, K. ; Yasumoto, T. ; Matsu-ura, T. ; Endo, M. ; Iwase, N.

fYear

1993

fDate

9-11 Jun 1993

Firstpage

192

Lastpage

195

Keywords

Adhesives; Aluminum nitride; Gold; Land surface; Packaging; Pins; Residual stresses; Rough surfaces; Surface roughness; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

DOI

10.1109/IEMT.1993.639750

Filename

639750

Link To Document