DocumentCode :
2761227
Title :
Amplitude and phase acoustic microscopy for ceramic bearing ball inspections
Author :
Chou, C.H. ; Hsieh, C.P. ; Khuri-Yakub, B.T.
Author_Institution :
Stanford Univ., CA, USA
fYear :
1990
fDate :
4-7 Dec 1990
Firstpage :
887
Abstract :
The problem of inspecting different types of defects in ceramic bearing balls is addressed. An amplitude and phase acoustic microscope that operates in the frequency range of 1-200 MHz is used. In one configuration, an x-y scanner is used. With image processing, the circular interference fringes which are due to the spherical shape of the bearings are removed. Another system configuration uses a rotational scanning stage to rotate the bearing ball and applies differential phase measurement techniques to improve the phase measurement accuracy to 0.4°. The third configuration was developed for the measurement of subsurface defects. It also uses a rotation stage, but with a broadband transducer in order to separate the surface wave echo from the specular reflected signal. A theoretical model is to deal with wave propagation on the spherical surface, and it is predicted that the surface wave is focused to a diffraction-limited spot 0.36 Rayleigh wavelengths at the 3-dB points
Keywords :
acoustic microscopy; ceramics; crack detection; flaw detection; inspection; ultrasonic materials testing; 1 to 200 MHz; Rayleigh wavelengths; amplitude acoustic microscopy; broadband transducer; ceramic bearing ball inspections; circular interference fringes; defects; differential phase measurement techniques; diffraction-limited spot; image processing; phase acoustic microscopy; phase measurement accuracy; rotational scanning stage; specular reflected signal; spherical shape; subsurface crack detection; subsurface defects; surface wave; surface wave echo; x-y scanner; Ceramics; Frequency; Image processing; Interference; Microscopy; Phase measurement; Predictive models; Shape; Surface waves; Transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 1990. Proceedings., IEEE 1990
Conference_Location :
Honolulu, HI
Type :
conf
DOI :
10.1109/ULTSYM.1990.171491
Filename :
171491
Link To Document :
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