Title :
Atmospheric batch self-aligned assembly using Au-Sn solder bumps for optical MCM
Author :
Sasaki, Juni´chi ; Itoh, Masataka
Author_Institution :
Assoc. of Super-Adv. Electron. Technol., NTT Musashino Res. & Dev. Center, Tokyo, Japan
Abstract :
We described a multichip module (MCM) structure suitable for building large-capacity optical interconnects using batch self-aligned assembly for optical devices. This technique was adapted to 622-Mbps x 12-channel optical interconnection modules. This technique was demonstrated to be effective for the assembly of highly integrated large-channel optical interconnection modules
Keywords :
multichip modules; optical fabrication; optical interconnections; self-assembly; soldering; 12-channel optical interconnection modules; Au-Sn solder bumps; atmospheric batch self-aligned assembly; batch self-aligned assembly; highly integrated large-channel optical interconnection modules; large-capacity optical interconnects; multichip module structure; optical MCM; optical devices; Assembly; Bonding; Diode lasers; Optical arrays; Optical fiber networks; Optical interconnections; Optical receivers; Oxidation; Photodiodes; Semiconductor laser arrays;
Conference_Titel :
Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE
Conference_Location :
Rio Grande
Print_ISBN :
0-7803-5947-X
DOI :
10.1109/LEOS.2000.894127
