Title :
Thermal analysis and optimization of a small, high density DC power system by finite element analysis (FEA)
Author_Institution :
Northern Telecom Ltd., Lachine, Que., Canada
Abstract :
Today, the trend in power for is towards compact, modular systems. While packaging is small, the power density is high. Cooling by natural convection becomes marginal and designing for optimal heat dissipation is challenging. In this paper, a basic understanding of thermodynamics is presented. Heat transfer by conduction, convection and radiation and the FEA method are briefly defined. The convective heat transfer coefficient, the major factor in an accurate thermal analysis, is discussed in some detail. The thermal design of a selected compact, modular DC power supply is analyzed and optimized with the aid of FEA. Demonstrated are 3D model building, thermal analysis and results and the optimization method
Keywords :
design engineering; finite element analysis; heat transfer; optimisation; power supplies to apparatus; thermal analysis; thermodynamics; compact modular DC power supply; conduction; convective heat transfer coefficient; finite element analysis; natural convection cooling; optimal heat dissipation; power density; radiative heat transfer; thermal analysis; thermal design; thermal optimization; thermodynamics; Cogeneration; Design optimization; Finite element methods; Fluid flow; Heat transfer; Integrated circuit modeling; Power system analysis computing; Power system modeling; Temperature; Testing;
Conference_Titel :
Telecommunications Energy Conference, 1996. INTELEC '96., 18th International
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-3507-4
DOI :
10.1109/INTLEC.1996.573414
