Actual problems of thin film deposition for hybrid applications

Author

Muralt, P. ; Seidel, J.P.

Author_Institution

Balzers AG, Liechtenstein

fYear

1989

fDate

26-28 Apr 1989

Firstpage

251

Lastpage

254

Abstract

The LLS 900 load lock system is described. Its four planar magnetron stations operated with either DC or RF power and three reactive gas inlets allow complex processes to be performed. Automatic control and execution of process parameters ensures a good reproducibility. The use of the LLS 900 system for the solution of actual manufacturing problems in the case of hybrid coatings is discussed. Examples of low TCR (temperature coefficient of resistance) films with a high sheet resistance, reliable barrier layers near-bulk-resistivity gold contact layers, and high-resistivity isolation layers are considered

Keywords

hybrid integrated circuits; integrated circuit technology; sputter deposition; Au contact layers; LLS 900 load lock system; RF power; TCR; barrier layers; complex processes; high-resistivity isolation layers; hybrid applications; hybrid coatings; planar magnetron stations; reactive gas inlets; reproducibility; sheet resistance; thin film deposition; Automatic control; Coatings; Conductivity; Gold; Manufacturing; Packaging machines; Reproducibility of results; Resistors; Sputtering; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International

Conference_Location

Nara

Type

conf

DOI

10.1109/IEMTS.1989.76150

Filename

76150