A Comparative Study Of Cohhercially Availarle No-Clean Solder Pastes : The Influence Of A Protective Atmosphere

Author

Potier, N. ; Mellul, S. ; Leturmy, M.

fYear

1993

fDate

9-11 Jun 1993

Firstpage

330

Lastpage

336

Keywords

Assembly; Atmosphere; Cleaning; Manufacturing; Protection; Soldering; Solvents; Surface-mount technology; Testing; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

DOI

10.1109/IEMT.1993.639794

Filename

639794

Link To Document