DocumentCode :
2763472
Title :
Tape Automated Bonding Packages: Electrical Considerations For High Frequency Applications
fYear :
1993
fDate :
9-11 Jun 1993
Firstpage :
341
Lastpage :
344
Keywords :
Attenuation; Bonding; Ceramics; Conductors; Coplanar transmission lines; Dielectric constant; Frequency; Impedance; Integrated circuit packaging; Power transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
Type :
conf
DOI :
10.1109/IEMT.1993.639798
Filename :
639798
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2763472
