DocumentCode
2763579
Title
Inkjet plating resist for improved cell efficency
Author
Dong, Hua ; Barr, Robert ; Hinkley, Peter
Author_Institution
Dow Electron. Mater., Marlborough, MA, USA
fYear
2010
fDate
20-25 June 2010
Abstract
The use of a resist applied before nickel and silver plating can greatly reduce background plating while helping to control plated line width spread on the front side of the solar cell grid. Reduced line spread helps to minimize shadowing and has a positive impact on cell efficiency.
Keywords
electroplating; nickel; silver; solar cells; Ag; Ni; cell efficiency; inkjet plating resist; plated line width spread control; solar cell grid;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE
Conference_Location
Honolulu, HI
ISSN
0160-8371
Print_ISBN
978-1-4244-5890-5
Type
conf
DOI
10.1109/PVSC.2010.5615932
Filename
5615932
Link To Document