DocumentCode :
2763634
Title :
Optimization trade-offs for vector volume and test power
Author :
Pouya, Bahram ; Crouch, Alfred L.
Author_Institution :
ColdFire Core Technol. Center, Motorola Inc., Austin, TX, USA
fYear :
2000
fDate :
2000
Firstpage :
873
Lastpage :
881
Abstract :
In today´s large designs, especially large SOC (system-on-a-chip) designs, vector volume for a single core could dominate the memory resources of the target tester and leave little or no room for other vectors. To this end, delivery of an “optimized” or “reduced” vector set, without any loss of coverage, is preferred. One commercial means of delivering an optimized vector set is to compress the vectors during vector generation. Another applicable solutions to understand the overlapping faults among various fault models and remove them from the fault lists for certain pattern types. The main problem with these optimization approaches is that compressed vectors create more switching activities, which could potentially cause average power dissipation, instantaneous and peak power during test to be significantly higher than normal operation. Test power is such a big concern in large SOC designs that the power associated with the “reuse” vectors must be understood. This paper presents a case study of a Motorola Version 3 ColdFire(R) microprocessor core, with a focus on the various vector optimizations and their ramifications on test power
Keywords :
automatic test pattern generation; circuit optimisation; design for testability; integrated circuit testing; logic design; logic testing; microprocessor chips; ColdFire(R) microprocessor core; Motorola Version 3; compressed vectors; memory resources; optimization; optimized vector set; overlapping faults; pattern generation; peak power; power analysis; switching activities; system-on-a-chip; target tester; transition delay pattern set; Automatic test pattern generation; Circuit faults; Clocks; Flip-flops; Logic design; Logic testing; Microprocessors; Power dissipation; System testing; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 2000. Proceedings. International
Conference_Location :
Atlantic City, NJ
ISSN :
1089-3539
Print_ISBN :
0-7803-6546-1
Type :
conf
DOI :
10.1109/TEST.2000.894298
Filename :
894298
Link To Document :
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