Title :
Thermal Stress Analysis Of Conductive Adhesive Joints
Author :
Ogunjimi, A.O. ; Whalley, D.C. ; Williams, D.J.
Keywords :
Assembly; Bonding; Conductive adhesives; Curing; Geometry; Manufacturing; Material properties; Silicon; Thermal conductivity; Thermal stresses;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639801
