Thermal stresses in L and T shaped metal interconnects: a three dimensional analysis

Author

Shen, Y.-L.

Author_Institution

Dept. of Mech. Eng., New Mexico Univ., Albuquerque, NM, USA

fYear

1999

fDate

1999

Firstpage

283

Lastpage

290

Abstract

Numerical analyses of thermal stresses in L and T shaped aluminum interconnects were carried out using three-dimensional finite element modeling. The evolution of stress and deformation fields in passivated and unpassivated lines with different aspect ratios were quantified. Implications for the design of test interconnect structures for spatially resolved stress measurements and related reliability issues were discussed

Keywords

aluminium; deformation; finite element analysis; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; stress measurement; thermal stresses; 3D finite element modeling; 3D thermal stress analysis; Al; L shaped metal interconnects; T shaped metal interconnects; aluminum interconnects; deformation field evolution; line aspect ratios; numerical analysis; passivated lines; reliability; spatially resolved stress measurements; stress field evolution; test interconnect structure design; thermal stresses; unpassivated lines; Aluminum; Geometry; Integrated circuit interconnections; Numerical analysis; Spatial resolution; Stress measurement; Tensile stress; Testing; Thermal expansion; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International

Conference_Location

San Diego, CA

Print_ISBN

0-7803-5220-3

Type

conf

DOI

10.1109/RELPHY.1999.761627

Filename

761627